synth_tools

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TE, 826576-9, 9 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41792-0005 example for new mpn: 39-29-4189, 9 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTB_2,5/13-GF-5,08; number of pins: 10; pin pitch: 3.50mm; Vertical || order number: 1924279 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/3-GF-3.81; number of pins: 04; pin pitch: 5.08mm; Angled; threaded flange || order number: 1766275 12A 630V Generic Phoenix Contact SPT 2.5/12-H-5.0-EX Terminal Block, 1990805 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990805), generated with kicad-footprint-generator JST PUD series connector, B13B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST ZE series connector, S12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770182-x, 3 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 8 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 22.86 mm (900 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 64-lead though-hole.

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