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KingTek_DSHP04TS, Slide, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 28-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST Omron_A6H-10101, Slide, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 10x-dip-switch SPST KingTek_DSHP10TS, Slide, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 28-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303.

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