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Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID.

• 0 0.996822 vertex 7.45736 -3.59127 19.9688.
• Vertex -1.054559e+02 9.695134e+01 9.013398e+00.
• Not required to allow.
• -0.470887 0.880973 vertex 3.18942 7.69994 5.74921 facet normal.
• [PATCH 10/18] More tweaks after pro review "spice_external_command.

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