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28 Pin (JEDEC MO-194 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1130, 11 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm strain-relief Soldered wire connection with feed through strain relief, for 2 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.5mm, size 43x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00298_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo.

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