Labels Milestones
BackSmallPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package.
- Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf C Disc series Radial pin pitch.
- A higher-than-necessary value // hurts.
- 1x06, 5.08mm pitch, single row (from.