3
1
Back

Package; 48 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP, 52 Pin (JEDEC MO-153 Var CD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST EH series connector, 505405-1270 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://docs.broadcom.com/doc/APDS-9251-001-DS#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (JEDEC MO-153 Var.

New Pull Request