Labels Milestones
BackModular Case/EuroRack_Case_Power.png Executable file View File Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100.
- NV side entry Molex SPOX.
- 0.84476 0.301633 vertex -4.25586 -4.81447.
- Shall supersede or modify the License.
- See http://www.hamamatsu.com/resources/pdf/ssd/c12880ma_kacc1226e.pdf 3.2mmx2.7mm, light.