Labels Milestones
Back(SO) - Wide, 5.3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole.
- -1.071647e+02 9.665134e+01 1.291051e+01 facet normal 8.050200e-02.
- 14x14mm body, 9.5mm sq thermal pad 3x2mm Pitch.