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Of 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78HB-0.5L, SIP-3, Horizontally Mounted, pitch 2.54mm, size 30.94x6.5mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size.

-2.553552e-003 8.191390e-001 vertex 5.158889e+000 -1.045236e+000 2.488700e+001 facet normal.
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