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# Exported BOM files *.xml *.csv # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: merged pull request synth_mages/MK_VCO#5 613d1b6f7e Merge pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 **Component Count:** 75 0 0 Y N 1 F N DEF SW_E3_SA3216 SW 0 0 Y N 2.

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