synth_tools

Back

Box header, 2x04, 2.00mm pitch, double rows Through hole angled pin header, 2x32, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x38 2.00mm single row Through hole angled socket strip THT 1x02 2.54mm single row Through hole socket strip THT 1x06 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x36 1.27mm single row Through hole angled pin header, 2x18, 2.00mm pitch, double rows Through hole pin header SMD 1x30 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x37, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf.

New Pull Request

Labels Milestones