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Bin 38860 -> 0 bytes (group "" (id efdac9a8-63a2-4056-9007-59528f4494a3 Latest commits for file Images/IMG_6770.JPG Binary files /dev/null and b/caixa_sr2.png differ From 900028d3cfd83c8e79e6eea5e382790306fbb1e8 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Checkpoint before trying to add picture master PSU/Synth Mages Power Word Stun.kicad_pcb Normal file View File # ENV Envelope generator main VCA/Schematics/Dual_VCA_with_cv2_OTA.diy 7462 lines PSU/Synth Mages Power Word Stun Panel.kicad_pcb Normal file Unescape Schematics/SynthMages.pretty/6.3mm_NPTH_MAXJLCPCB.kicad_mod Normal file Unescape Hardware/Panel/precadsr-panel/sym-lib-table Normal file Unescape module railWithHoles(height) { difference(){ color([.1,.1,.1]) panel(width); //module title(string, size=9, halign="center", font="Futura XBlk BT:style=Extra Black") { //} // draw a "vertical" wall to mount the circuit board sideways on d923559173 Go to file 6523065365 updates the potentiometer pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 7, Wuerth electronics 97730406330 (https://katalog.we-online.com/em/datasheet/97730406330.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-8010, 80 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board.

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