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Do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for branch fewer_panel_wires Move LED resistors Checkpoint after fixes but before shrinking boards 007cc05932dfa23f85127799f5505afc7b25772e Stuff all teh scad files in Still trying to fit in glide controls More mounting hole 6.4mm no annular m8 Mounting Hardware, inside through hole M2, height 4, Wuerth electronics 9775026360 (https://katalog.we-online.com/em/datasheet/9775026360.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH41-30S-0.5SH, 30 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator Harting har-flexicon vertical Harting har-flexicon series connector, LY20-42P-DLT1, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging.

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