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B3B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST VH series connector, S10B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VLGA, 4 Pin (http://www.ixysic.com/home/pdfs.nsf/www/CPC1017N.pdf/$file/CPC1017N.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 28 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 12)), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xx-DV-PE-LC, 27 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PH series connector, 502585-1170 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 44 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, With thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 68 pins, surface mount SMD Kemet EC2 signal relay DPDT double coil latching surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching through hole M3, height 4.6, Wuerth electronics 9774030243 (https://katalog.we-online.de/em/datasheet/9774030243.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-138-02-xxx-DV-BE-LC, 38 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 14, Wuerth electronics 9774025943 (https://katalog.we-online.de/em/datasheet/9774025943.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 4, Wuerth electronics 9774060951 (https://katalog.we-online.de/em/datasheet/9774060951.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-05P-1.25DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 0.127 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times.

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