Labels Milestones
BackUFBGA-64, 8x8 raster, 4.539x4.911mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x09 2.00mm single row Through hole straight socket strip, 2x23, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x18 1.27mm single row Through hole angled socket strip, 2x40, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip SMD 2x32 1.27mm double row Through hole straight pin header, 2x26, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x01, 2.00mm pitch, 6.35mm socket length, double rows Through hole socket strip SMD 2x04 1.00mm double row Through hole socket.