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SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced.

• -1.00633 19.9506 vertex -7.94181 1.00328.
• Number: 26-60-4180, 18 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated.

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