Labels Milestones
BackSocket 20-lead though-hole mounted DIP package, row spacing 8.61 mm.
- 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 2.54mm IIPAK.
- Ai Thinker Ra-01 LoRa.
Socket 20-lead though-hole mounted DIP package, row spacing 8.61 mm.