Labels Milestones
BackGnd fill f63cfba954 Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm.
- 0.741154 0.224826 0.632569 vertex 3.34779.
- 502382-0670 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Hirose FH12.