Labels Milestones
BackModule 16-pin module, column spacing 22.86 mm (900 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin.
- Pack 5-pin Resistor SIP pack 10-pin.
- B03B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with.