Labels Milestones
Back15.4*15.4mm ESP32-S2-WROVER(-I) 2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth combo chip Single 2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf Single 2.4 GHz Wi-Fi and Bluetooth module Single 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, B12B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, With thermal vias in pads, 3 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.75 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Tantalum Capacitor SMD 3640 (9110 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator JST VH series connector, B05B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV-LC, 37 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 56 Pin (JEDEC MS-013AF, https://www.analog.com/media/en/package-pcb-resources/package/54614177245586rw_14.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-241/VAA, https://assets.nexperia.com/documents/package-information/SOT762-1.pdf), generated with kicad-footprint-generator JST PH series connector.
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