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0.8 CLG225 Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size 45.5x7.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310551_RT015xxHDWU_OFF-022723S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_TE-Connectivity THT Terminal Block Phoenix PT-1,5-14-5.0-H, 14 pins, single row style1 pin1 left Surface mounted pin header SMD 1x05 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x32 2.54mm double row SMD IDC box header THT 2x25 2.54mm double row Through hole pin header THT 1x06 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x17 1.00mm double row Through hole angled pin header SMD 2x40 1.00mm double row surface-mounted straight pin header, 2x29, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x02, 2.54mm pitch, double rows Through hole angled pin header SMD 1x31 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x10 1.00mm single row style2 pin1 right Through hole angled socket strip, 2x34, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled socket strip THT 2x07 2.54mm double row Through hole pin header THT 1x27 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x18 1.27mm double row Through hole pin header SMD 1x04 2.54mm single row style2 pin1 right Through hole straight Samtec HPM power header series 11.94mm post length THT 1x04 5.08mm single row Surface mounted socket strip SMD 1x11 2.54mm single row Through hole angled pin header, 2x38, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x25 2.00mm double row Through hole angled socket.

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