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73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 pin, 4x4mm, 2.1mm sq pad (http://www.analog.com/media/en/technical-documentation/data-sheets/ADG633.pdf LFCSP, 16 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/16L_VQFN-WFS_3x3mm_4MX_C04-00508a.pdf), generated with kicad-footprint-generator JST VH PBT series connector, 502382-0770 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63M-4P-3.96DSA, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 6.6, Wuerth electronics 9774050360 (https://katalog.we-online.de/em/datasheet/9774050360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4140, 14 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0144.PDF), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM08B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/drv8662.pdf#page=23), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-S (3216-12 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole pin header THT 2x13 1.27mm double row surface-mounted straight pin header, 1x35, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length, 1x13, 5.08mm pitch, single row style2 pin1 right Through hole straight pin header, 2x21, 1.00mm pitch, single row Surface mounted pin header SMD 1x32 1.00mm single row Through hole pin header THT 2x08 1.27mm double row surface-mounted straight pin header, 2x40, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x11 2.54mm double row Through hole angled pin header THT 2x37 2.54mm double row Through hole straight socket strip, 1x22, 1.27mm pitch, single row Through hole socket strip SMD 1x15 2.54mm single row Through hole angled socket strip SMD 1x20 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x31 2.54mm double row Connector IDC Locked, 10 contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole socket strip THT 1x14.

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