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Elektronik, Wuerth_HCI-5040, 5.5mmx5.2mm Inductor, Wuerth Elektronik, Wuerth_HCI-1350, 12.8mmx12.8mm Inductor, Wuerth Elektronik, Wuerth_HCI-1890, 18.2mmx18.2mm Inductor, Wuerth Elektronik, Wuerth_HCM-1070, 10.1mmx7.0mm Inductor, Wuerth Elektronik, Wuerth_MAPI-3010, 3.0mmx3.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-4040, 4.0mmx4.0mm Inductor, Wuerth Elektronik, Wuerth_HCI-7030, 6.9mmx6.9mm Inductor, Wuerth Elektronik, Wuerth_MAPI-3020, 3.0mmx3.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-50xx, 4.9mmx4.9mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-1616, 1.6mmx1.6mm inductor taiyo-yuden md smd Inductor, Vishay, Vishay_IHSM-3825, http://www.vishay.com/docs/34018/ihsm3825.pdf, 11.2mmx6.3mm inductor vishay ihlp smd Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-3030, 3.0mmx3.0mm Inductor, Wuerth Elektronik, WE-PD, SMT, Typ M, Typ S, https://katalog.we-online.com/pbs/datasheet/744878001.pdf, https://katalog.we-online.de/pbs/datasheet/744877001.pdf Choke Coupled Double Inductor SMD Pulse PA4320 http://productfinder.pulseeng.com/products/datasheets/P787.pdf Inductor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline Narrow Body (http://www.analog.com/media/en/technical-documentation/data-sheets/ADuM7640_7641_7642_7643.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 28 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 2.54mm TO-220-5, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 2.54mm TO-247-5, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 2.54mm TO-220-4 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.54mm, staggered type-1 TO-220F-9, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 8.89 mm (350 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf.

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