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HSOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator connector wire 2sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size 17.5x7.6mm^2, drill diamater 1.3mm, pad diameter 3mm.

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