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HLE-118-02-xx-DV-TE, 18 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=39), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5080, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 48 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220F-5, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 2.286mm Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint] SOT-227 / SOT-227B / ISOTOP, M4 mounting hole 8.4mm no annular Mounting Hole 6.4mm, M6 mounting hole 3.7mm no annular m3 iso7380 Mounting Hole 6.4mm, no annular, M5 mounting hole 3.2mm no annular m5 din965 Mounting Hole 6.4mm, M6, DIN965 mounting hole 6.4mm no annular Mounting Hole 6.4mm, M6 mounting hole 5.3mm no annular m6 iso14580 Mounting Hole 5.3mm, no annular, M3 mounting hole 3.2mm m3.

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