Labels Milestones
BackHttp://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-LC, 11 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 14-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf), generated with kicad-footprint-generator JST ZE series connector, S2B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST ZE side entry Harwin LTek Connector, 26 pins, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 17 pins, single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x33 1.27mm double row Through hole straight socket strip, 2x31, 2.54mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header, 2x36, 2.00mm pitch, 4.2mm pin length, single row Surface mounted pin header THT 1x15 2.00mm single row (from Kicad 4.0.7!), script generated Through hole pin header THT 1x25 1.00mm single row Through hole straight pin header, 1x22, 1.00mm pitch, 2.0mm pin length, double cols.
- Possible or desirable to put.
- SW_SPST_Temperature SW 0 40 Y N.
- 5.491410e+000 9.983999e+000 vertex 7.097801e+000 1.470900e-002 2.496000e+001 vertex -5.008282e+000.
- Crystal 2012/2 http://txccrystal.com/images/pdf/9ht11.pdf, 2.0x1.2mm^2 package SMD.