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11mm width 5.0mm Capacitor C, Rect series, Radial, pin pitch=22.50mm, , length*width=26.5*8.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 5.08mm size 25.4x8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00066 45Degree pitch 10mm size 35x8.1mm^2 drill 1.1mm pad 2.2mm Terminal Block WAGO 236-102 45Degree pitch 5mm size 25x10mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 804-105 45Degree pitch 7.5mm size 69.8x14mm^2 drill 1.15mm pad 3mm Terminal Block TE 1-282834-1, 11 pins, pitch 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Vertical RM 5.08mm TO-220F-3, Horizontal, RM 2.54mm, staggered type-1 TO-220F-15, Vertical, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 5.08mm TO-126-2, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL ZIF 15.24mm 600mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin.

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