Labels Milestones
BackIpc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On Type FFC/FPC, 502250-2191, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf), generated with kicad-footprint-generator JST ZE series connector, B8B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST ZE series connector, S5P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_40_14.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 1.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 2mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 6, Wuerth electronics 9774020960 (https://katalog.we-online.de/em/datasheet/9774020960.pdf,), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 43915-xx06, With thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.8mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.65mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.8mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3x3mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20.
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