Labels Milestones
BackPhoenix PT-1,5-16-5.0-H, 16 pins, pitch 5mm, size 20x9mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF13-09P-1.25DSA, 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST VH PBT series connector, 502382-1570 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 20 Pin (https://resurgentsemi.com/wp-content/uploads/2018/09/MPR121_rev5-Resurgent.pdf?d453f8&d453f8), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV-A, 43 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3391, 33 Circuits (https://www.molex.com/pdm_docs/sd/5022313300_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-1791, 17 Circuits (https://www.molex.com/pdm_docs/sd/2005280170_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 16 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL ZIF 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size.
New Pull Request