Labels Milestones
BackRaspberry Pi Zero using through hole M3, height 12, Wuerth electronics 9774055951 (https://katalog.we-online.de/em/datasheet/9774055951.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-121-02-xxx-DV-LC, 21 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2091, 9 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.5mm, size 21x6.5mm^2, drill diamater 1.4mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix PT-1,5-3-3.5-H, 3 pins, single row Surface mounted pin header THT 2x03 2.54mm double row Through hole IDC header, 2x06, 2.54mm pitch, 8.51mm socket length, single row Through hole pin header THT 2x37 1.27mm double row Through hole straight pin header, 1x07.
- 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261.
- Initiate litigation against any.