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Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=11791&prodName=TLP185), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size 42.7x7mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10700.pdf.

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