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For: MCV_1,5/7-GF-5.08; number of pins: 13; pin pitch: 5.08mm; Angled || order number: 1776773 12A || order number: 1847534 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/7-G-5.08; number of pins: 06; pin pitch: 3.81mm; Angled || order number: 1777167 12A || order number: 1843334 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/2-GF; number of pins: 02; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1766783 12A 630V Generic Phoenix Contact connector footprint for: MC_1,5/9-G-3.81; number of pins: 16; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1755820 12A || order number: 1924282 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-3.81; number of pins: 06; pin pitch: 5.08mm; Vertical || order number: 1843826 8A 160V Generic Phoenix Contact SPT 5/12-H-7.5-ZB Terminal Block, 1990795 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990795), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Harting har-flexicon series connector, 505405-1570 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 502382-1070 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (JEDEC MO-153 Var DE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42819-32XX, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with kicad-footprint-generator JST ZE.

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