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Dual flag WDFN-8 1EP 2.2X2.0 0.5P WDFN, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0103, 3 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Inductor SMD Wuerth WE-DD TypL TypXL TypXXL Shielded Coupled Inductor, Wuerth Elektronik, Wuerth_MAPI-3010, 3.0mmx3.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-24xx, 2.4mmx2.4mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-60xx, 6.0mmx6.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-20xx, 2.0mmx2.0mm inductor taiyo-yuden md smd Inductor, Sagami, h=6.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Inductor, Sagami, h=6.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Inductor, Sagami, h=6.0mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf Inductor, Sagami, h=4.5mm, http://www.sagami-elec.co.jp/file/CER1242B-CER1257B-CER1277B.pdf inductor sagami cwr12xx smd Sagami power inductor, CWR1242C, H=6.0mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf Sagami power inductor, 5.8x5.2x4.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0403 unshielded SMD power inductor, 7.8x7.0x3.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0703 unshielded SMD power inductor, CWR1242C, H=7.7mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf SMD Power Inductor WE-PDF Wuerth Shielded Power Inductor WE-PDF Wuerth Handsoldering L_Wuerth_WE-TPC-3816 StepUp generated footprint, https://www.infineon.com/cms/en/product/packages/PG-LLGA/PG-LLGA-5-1/ AKM Current Sensor, 7 pin, THT (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor tht AKM Current Sensor, 7 pin, THT (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor smd AKM VSOP-24 current sensor, 5.6x7.9mm body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST Copal_CHS-06B, Slide, row spacing 10.16.

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