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BackTechnology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 32-lead though-hole mounted high-volatge DIP.
- Ipc_gullwing_generator.py EQFP, 144 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425.
- Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Mounting_Holes.kicad_mod create mode 100644 Hardware/Panel/precadsr_panel.png.