synth_tools

Back

Wiring 2x Sockets, all three pins need wires: glide in (sleeve and normal both GND Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: Glide, manual (A100k) (two left pins, from below) Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) - Clock rate (B100k) (not sure yet which 2 pins LED diameter 5.0mm z-position of LED center 3.0mm, 3 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-Lock series connector, S13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST GH series connector, BM11B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Fuse SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/NOS.pdf), generated with kicad-footprint-generator JST PH series connector, 502585-1570 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-20A1, example for new part number: 09-65-2048, 4 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Hirose DF13 through hole, DF63R-3P-3.96DSA, 3 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 11x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 8x-dip-switch SPST.

New Pull Request

Labels Milestones