synth_tools

Back

Film capacitor | | C3, C4, C5 | 2 Synth Mages Power Word Stun.kicad_pro From 720296ca7c6a75e44bd21e28d4f7a15a3feff490 Mon Sep 17 00:00:00 2001 From 2c2abd88373d920f2947e97b48bd4d62ed1339f7 Mon Sep 17 00:00:00 2001 Subject: [PATCH] adds front panel and pcb into different files Add a front-panel PCB Add a front-panel PCB Add four more switches/buttons, move LED drivers onto PCB added the once through idea with commentary by Correcting changed filename in .prl gets jiggy with PCB trace layout 4efd2875e8 Replaced accidentally dropped Fine tuning hole. Main synth_tools/Schematics/SynthMages.pretty/P160_pot_hole_nonpcb.kicad_mod 24 lines Binary files /dev/null and b/3D Printing/Panels/Radio_shaek_standoff_padded.stl differ Binary files /dev/null and b/3D Printing/Rails/18hp_outie.stl differ Binary files /dev/null and b/musescore_example.mscz differ * Knurled cylinder outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF11-6DP-2DSA, 3 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator JST PH series connector, B15B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator JST EH series connector, B10B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, DF3EA-09P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-10A1, example for new mpn: 39-30-0080, 4 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 2, Wuerth electronics 9775046960 (https://katalog.we-online.com/em/datasheet/9775046960.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 11.6, Wuerth electronics 9774020482 (https://katalog.we-online.de/em/datasheet/9774020482.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, LY20-26P-DT1, 13 Circuits (https://www.molex.com/pdm_docs/sd/2005280130_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 6, Wuerth electronics 9774090960 (https://katalog.we-online.de/em/datasheet/9774090960.pdf,), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 16 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size.

New Pull Request

Labels Milestones