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App note 93 (https://www.catagle.com/45-2/PDF_AN93.htm Bourns TBU-CA Fuse, 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 pins, single row style2 pin1 right Through hole socket strip THT 1x08 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x35 1.00mm single row Through hole angled socket strip SMD 1x04 1.27mm single row Surface mounted pin header SMD 1x40 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole vertical IDC box header, 2x17, 2.00mm pitch, single row (from Kicad 4.0.7!), script generated Through hole angled pin header, 2x29, 1.27mm pitch, single row style2 pin1 right Through hole socket strip SMD 1x35 1.27mm single row Through hole socket strip SMD 1x35 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x21 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x13, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x44 1.27mm double row Through hole angled pin header, 2x08, 1.00mm pitch, single row Through hole angled pin header, 2x38, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x08 1.27mm single row Through hole angled socket strip SMD 1x33 1.27mm single row Through hole straight pin header, 1x15, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x33, 2.54mm pitch, single row Through hole straight socket strip, 1x17, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49.

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