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(http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD Sub-miniature slide switch, EG series, DPDT, right angle, http://www.nkkswitches.com/pdf/GW.pdf switch single-pole double-throw ON-OFF-ON D Single Pole Single Throw (SPST) switch, small symbol D 12x DIP Switch, Single Pole Single Throw (DPST) Switch, temperature dependent Schematics/SynthMages.pretty/Switch.lib Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/DIN5.kicad_mod Normal file View File 3D Printing/Rails/18hp_outie.stl Normal file View File Schematics/notes.txt Normal file View File Panels/FireballSpellVertVerySmall.png Normal file Unescape Schematics/SynthMages.pretty/Perfboard_1x12.kicad_mod Normal file Unescape Schematics/SynthMages.pretty/PinSocket_1x03_P2.54mm_Vertical.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x10_P2.54mm_Vertical.kicad_mod Normal file View File 3D Printing/Cases/Eurorack 2-Row/2row_frame.scad Executable file View File Synth Mages Power Word Stun Panel.kicad_pro | 229 Synth Mages Power Word Stun.kicad_pcb 23164 lines 774c07c353 Go to file db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill Find and replace.

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