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Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400.

• Normal -4.225716e-001 -2.813669e-003 9.063252e-001 vertex 5.239015e+000 2.034783e+000.
• 7.35588 6.0001 vertex -6.92908 2.87013 6.0001 vertex.
• 9.534050e-01 7.361366e-03 3.016037e-01 facet normal 0.865137 0.462425.

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