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HLE-108-02-xx-DV-TE, 8 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator JST XH series connector, 504050-1091 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-28DP-2DSA, 14 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S04B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (JEDEC MO-194 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Wire Pad, Square, SMD Pad, 5mm x 10mm, MesurementPoint Square SMDPad 5mmx10mm Wuerth WR-WTB series connector, S08B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0810, with PCB locator, 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 6.6, Wuerth electronics 97730506330 (https://katalog.we-online.com/em/datasheet/97730506330.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-BE, 3 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator JST PHD series connector, B12B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST PUD series connector, 53261-0271 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-1310, 13 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads.

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