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Type D, THT/SMD hybrid, 0.4mm pitch, 19 ckt, right angle (http://www.molex.com/pdm_docs/sd/483930003_sd.pdf USB 3.0 type A right angle Molex 0.50mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-1791, 17 Circuits (https://www.molex.com/pdm_docs/sd/2005280170_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 11, Wuerth electronics 9774070360 (https://katalog.we-online.de/em/datasheet/9774070360.pdf), generated with kicad-footprint-generator Hirose series connector, 505405-0270 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Capacitor SMD 3640 (9110 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 1.5, Wuerth electronics 9775056960 (https://katalog.we-online.com/em/datasheet/9775056960.pdf), generated with kicad-footprint-generator Hirose series connector, B4PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf7045_en.pdf Inductor, TDK, SLF6025, 6.0mmx6.0mm (Script generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SS)-5.30 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area.

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