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Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99089A pressure sensor automotive honeywell Pressure Sensor, Dual-Barbed, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=MS5525DSO&DocType=DS&DocLang=English LEM LV25-P Voltage transducer, https://www.lem.com/sites/default/files/products_datasheets/lv_25-p.pdf LEM Hall Effect Voltage transducer 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 42-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST 1P1T CK components KMR2 tactile switch switch normally-open pushbutton push-button LED D MEC 5G single pole normally-open tactile switch SPST right angle, PTS645VL39-2 LFS tactile switch SPST angled PTS645VL39-2 LFS C&K Button tactile switch with Signal Lamp, generic K switch SPST right angle, http://spec_sheets.e-switch.com/specs/P040170.pdf Switch, single pole double throw K switch sp3t ON-ON-ON D Switch, triple pole double throw Precision Timers, 555 compatible, PDIP-8 | | | J1 | 1 | SW_DPDT_x2 | Switch, triple pole double throw, separate symbols aa68d7a21d Am totally not using git correctly More experimentation with panel alignment before printing.

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