Labels Milestones
BackPackage (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x22.5mm.
- RM 10.95mm SOT-93 TO-218-2, Vertical, RM 2.54mm, staggered.
- Phoenix MKDS-1,5-4-5.08, 4 pins, pitch 5.08mm.