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Https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP.

• OffsetToMountHoleCenterY=mountSurfaceHeight/2; offsetToMountHoleCenterX = hp - holeOffset; // 1.
• 22 Panels/title_test.stl | Bin 138868 .

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