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DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (JEDEC MO-153 Var EF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, external M3, height 14, Wuerth electronics 9774030360 (https://katalog.we-online.de/em/datasheet/9774030360R.pdf), generated with kicad-footprint-generator connector wire 1.5sqmm strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.5 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Capacitor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex Pico-Lock series connector, B2B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/6-GF-3.81; number of pins: 12; pin pitch: 5.00mm; Angled; threaded flange || order number: 1843347 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/15-GF; number of pins: 16; pin pitch: 3.50mm; Angled; threaded flange || order number: 1806261 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-3.5; number of pins: 12; pin pitch: 7.62mm; Vertical; threaded flange || order number: 1776838 12A solder Pin_ with flat with hole, hole diameter 1.0mm wire loop with bead as test Point, square 1.0mm side length, hole diameter 1.1mm, length 10.2mm, width 3.5mm Capacitor C, Rect series, Radial, pin pitch=27.50mm, , length*width=33*20mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 5.00mm diameter 19mm supercapacitor Tantalum Capacitor.

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