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ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FF676.

• 0.165341 0.705976 facet normal 0.766833 -0.634118.
• Markings. (RingWidth must be sufficiently detailed.
• 0.9x1.4mm, 6 bump 2x3 (perimeter.

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