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Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/16L_UQFN_4x4x0_5mm_JQ_C04257A.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors.

Connector, S14B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated.
1x38 1.00mm single row (from Kicad 4.0.7), script.
0.312847 -0.468207 -0.826383 vertex.
) New KiCad version; non.

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