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Back83b013c3637bfb179ad62b90a6c8b2f5fb547c8c Update README.md 32ece2d681b26731bad50902587b988d6a79e43e updated README.md updated README.md updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 18 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad 3x2mm Pitch 0.5mm LFCSP, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13), generated with kicad-footprint-generator.
- SOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with.
- -1.691408e-02 0.000000e+00 -9.998569e-01 facet normal 0.989338 0.097471.