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Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [HTSSOP], with thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch.

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