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IA48xxD DIP DCDC-Converter XP_POWER IHxxxxD, DIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-10P-1.25DSA, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-A, 48 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py SOT, 3 Pin (https://www.jedec.org/system/files/docs/to-236h.pdf variant AB), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-16A2, example for new part number: A-41791-0005 example for new mpn: 39-28-904x, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf), generated with kicad-footprint-generator connector JST ACH series connector, 502382-1070 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-127-02-xxx-DV-LC, 27 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator JST XH series connector, SM05B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1000 (alternative finishes: 43045-242x), 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-05A example for new mpn: 39-30-0180, 9 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6.

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